The ET977 is a low-power COM Express Compact Type 6 modules based on the AMD Ryzen™ Embedded SoC to enable next-generation embedded designs. The series targets a wide range of applications including AIoT, retail, medical, transportation, automation and gaming fields. It allows users to deliver compact embedded solutions with a new class of performance and power efficiency.

  • Onboard AMD Ryzen™ Embedded V1000/ R1000 Processor
  • 2x DDR4-2400 SO-DIMM Sockets, Max. 32GB, ECC Compatible
  • Supports up to 4x Independent Displays (HDMI/DVI/DisplayPort, LVDS, and eDP) via the Carrier Board
  • 4x USB 3.1, 8x USB 2.0, 2x SATA III
  • Supports TPM 2.0

Built with the AMD Ryzen™ Embedded V1000/R1000 SoC, the board is very suitable for modular designs and platforms that require high scalability to meet customers’ time-to-market needs.

The new ET977 provides powerful computing with ‘Zen’ CPU cores and excellent image processing performance with the integrated AMD Radeon Vega graphics with 3 compute units to deliver stunning visual experiences. It features four (V1000) or three (R1000) independent displays (HDMI/DVI/DP, LVDS or eDP) with up to 4K UltraHD resolutions and two DDR4 SO-DIMM slots for up to 32GB memory and with ECC compatibility.

The unit provides a wealth of advanced connectivity options including 2x serial, 4x USB 3.1, 8x USB 2.0, and 2x SATA 6Gb/s ports, as well as high-speed PCIe 3.0 lanes. Measuring 125mm x 95 mm, the Computer-on-Module is available in V1807B and V1605B variants for high computing and R1606G variant for low-power applications. Both Windows 10 and Linux Ubuntu are supported.

ET977-1605LV: COM Express (Type 6) CPU Module with AMD Ryzen™ V1605B QC APU (3.6GHz), DDR4 dual-channel memory, supports LVDS
ET977-1606LV: COM Express (Type 6) CPU Module with AMD Ryzen™ R1606G DC APU (3.5GHz), DDR4 dual-channel memory, supports LVDS
ET977-1505LV: COM Express (Type 6) CPU Module with AMD Ryzen R1505G DC APU (2.4GHz~3.5GHz), DDR4 dual-channel memory, support LVDS

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