KEY FEATURES:
- 2 x 2.5GbE Ports
- Multiple USB Ports and Serial Ports
- Multiple Internal Expansion Boards for Flexible Selection
- Various Optional Backplanes and Chassis
- CE/FCC Compliant
High-Performance 10th / 11th Generation Intel® Core™ Processor Fanless Embedded Computer. It is equipped with Q470/Q470E chipset, 2x SO-DIMM DDR4 2933 MHz (up to 64GB), and 12 V~28 V DC power.
KEY FEATURES:
TANK-XM810-i7AC-R10 | Ruggedized Fanless Embedded System with Intel® i7-10700TE 2.0GHz, (up to 4.4GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 2xHDMI, 14~28V DC and RoHS |
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TANK-XM810-i5AC-R10 | Ruggedized Fanless Embedded System with Intel® i5-10500TE 2.3GHz, (up to 3.7GHz, 6-core, TDP 35W), 8GB DDR4 pre-installed memory, 2xHDMI, 14~28V DC and RoHS |
TANK-XM810-i3BC-R10 | Ruggedized Fanless Embedded System with Intel® i3-10320 3.8GHz,(up to 4.6GHz, 4-core, TDP 65W), 8GB DDR4 pre-installed memory, 1xHDMI, 1xDP++,12~28V DC and RoHS |
Fanless DIN-Rail Embedded System,Intel® E3845 1.91GHz/Intel® N2800 1.86GHz Solution
More InfoFanless Computer with Intel 6th-Gen Skylake Core i7/i5/i3 CPU, 4x POE, 4x ISO COM, 2x DP, VGA, 4x USB 3.0, 9-36V
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