ICP Australia is proud to introduce iEi’s WAFER-EHL. Support for Intel Celeron J6412 on-board SoC is provided by the WAFER-EHL 3.5″ SBC. It comes with dependable performance, cutting-edge network connection, a wealth of I/O, low power consumption with a well-designed thermal solution, and a fanless design that fits compact chassis sizes for space-critical installations like AMR (Autonomous Mobile Robots) and small cabinets in factories. The WAFER-EHL has a PCI Express Gen3 x2 expansion slot, enabling customers to employ PCIe cards to increase the potential of IoT applications. System control, kiosk, digital signage, electric vehicle charging stations, and medical imaging are just a few examples of IoT edge applications where it excels.

The IEI WAFER-EHL motherboard is equipped with an Intel® Celeron® J6412 on-board SoC, which supports up to 2.6GHz, quad-core, 1.5M cache, and 10W TDP. It performs 75% better than the previous generation, with single-thread performance improvements of up to 1.7x and multi-thread performance improvements of up to 1.5x. The IEI WAFER-EHL processor advances CPU, graphics, and real-time performance while incorporating IoT features, manageability, security, and functional safety.

IEI has created IEI Heat Conduction Casing, a highly effective thermal solution for the 3.5″ motherboard (IHCC). The IHCC can significantly boost heat transfer efficiency, and we’ll maintain enhancing our heat sink designs to guarantee that we’re offering a cutting-edge thermal solution for the industrial sector. In order to transfer heat, the IHCC consists of a casing and a heat conduction block that is tailored to suit the CPU properly.

KEY FEATURES:
• On-board LPDDR4x 8GB, up to 16 GB
• Support triple Independent Displays with 1 x HDMI 1.4, 1 x DP 1.4, 1 x IEI iDPM slot
• Support 2 x USB 3.2 Gen 2,1 x SATA 6Gb/s
• Support 2 x Intel® I225V 2.5GbE
• Support 1 x M.2 A key, 1 x M.2 B key

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