AMI230

The AMI230 is a robust embedded system based on the 9th/8th Gen Intel® Core™ platform. Developed for smart factory, industrial automation, AIoT and other applications in harsh environments, the rugged AMI230 delivers exceptional computing and graphics performance with an extended operating temperature range of -20°C to 70°C, operating vibration up to 3Grms and over/under/reverse voltage protection.

The AMI230 series houses the Intel® Q370 MB230AF motherboard and is equipped with multiple high speed I/O including 8x USB 3.1, 4x COM, and 3x M.2 (B-Key, E-Key & M-Key) for NVMe storage, WiFi and 4G/LTE options, and HDMI/DP/DVI-D display interface. It also features four Gigabit Ethernet ports making it highly suitable for network related applications, iAMT (11.6) for system remote management and repair, TPM (2.0) security for preventing phishing attacks, and iSMART green technology for power on/off scheduling and power resume functions.

  • Fanless system with IBASE MB230 customized board
  • 9th/8th Gen Intel® Core™ i7/i5/i3 Desktop Processors
  • Dual SIM slots supports WWAN redundancy
  • 4x RJ45 Gigabit Ethernet port (2x Supports 802.3at PoE+) 3x M.2 (B-Key/E-Key/M-Key)
  • Supports Over/Under/Reverse voltage protection
  • iSMART, iAMT (11.6), TPM (2.0)

AMI230AF (Supports SIERRA module): Fanless box System with MB230AF, w/ Intel® Core™ i7/i5/i3 desktop Processor, 4x COM, 1x 8GB memory, 1x 2.5” 64GB MLC industrial-grade SSD, w/o power adaptor
AMI230AF-P: Fanless box System with MB230AF-P, w/ Intel® Core™ i7/i5/i3 desktop Processor, 4x COM, 1x 8GB memory, 1x 2.5” 64GB MLC industrial-grade SSD, w/o power adaptor
270W Power Adaptor Kit (optional): 270W (24V@11.25A) power adaptor kit Compatible with IEC62368-1/EN62368-1
Optional Accessories: Global 4G antenna kit for Sierra Wireless EM7565 module, M.2 (M-KEY 2280) Thermal kit

  • iBASE